Title:
ROOM TEMPERATURE-CURABLE COMPOSITION, SEALING MATERIAL AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/077942
Kind Code:
A1
Abstract:
A room temperature-curable composition which comprises: (a) an organosilicon compound containing a polyoxyalkylene group, said organosilicon compound having one or more hydrolyzable silyl group-containing monovalent organic groups represented by formula (1) at a molecular chain end per molecule and having a polyoxyalkylene structure in the main chain [in formula (1): R1 and R2 represent an alkyl group or an aryl group; R3 represents a hydrogen atom or an alkyl group; m is 1-3; n is 2 or more; and the broken line represents a bonding hand]; and (c) a curing catalyst. This room temperature-curable composition shows excellent rapid curability and high resistance against yellowing and can provide a cured product which is free from isocyanate silane and, therefore, has a low toxicity, even in the case of using, for example, an amine compound as a substitute for an organotin compound as a curing catalyst.
Inventors:
YAMAGUCHI TAKAHIRO (JP)
IWASAKI ISAO (JP)
IKENO MASAYUKI (JP)
SAKAMOTO TAKAFUMI (JP)
HIROKAMI MUNENAO (JP)
YAMADA TETSURO (JP)
IWASAKI ISAO (JP)
IKENO MASAYUKI (JP)
SAKAMOTO TAKAFUMI (JP)
HIROKAMI MUNENAO (JP)
YAMADA TETSURO (JP)
Application Number:
PCT/JP2018/035299
Publication Date:
April 25, 2019
Filing Date:
September 25, 2018
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L71/02; C08G77/08; C08G77/18; C08G77/20; C09J11/04; C09J11/06; C09J171/02; C09J183/00; C09J183/14; C09K3/10
Domestic Patent References:
| WO2015194340A1 | 2015-12-23 | |||
| WO2015162962A1 | 2015-10-29 | |||
| WO2016157948A1 | 2016-10-06 |
Foreign References:
| JP2017141450A | 2017-08-17 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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