Title:
ROUGHENED COPPER FOIL, CARRIER-ATTACHED COPPER FOIL, COPPER CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/157362
Kind Code:
A1
Abstract:
Provided is a roughened copper foil which can achieve both of excellent etching properties and high share strength in the processing of a copper clad laminate plate or the manufacture of a printed wiring board. The roughened copper foil has a roughened surface on at least one side thereof. In the roughened surface, the interface developed area ratio Sdr is 3.50% to 12.00% inclusive as measured in accordance with ISO25178 under the conditions including an S filter cut-off wavelength of 0.55 μm and an L filter cut-off wavelength of 10 μm. In the roughened copper foil, the core part level difference Sk is 0.15 μm to 0.35 μm inclusive as measured in accordance with ISO25178 under the conditions including an S filter cut-off wavelength of 0.55 μm and an L filter cut-off wavelength of 10 μm.
Inventors:
HOSOKAWA MAKOTO (JP)
TAKANASHI AKITOSHI (JP)
MIZOGUCHI MISATO (JP)
TAKANASHI AKITOSHI (JP)
MIZOGUCHI MISATO (JP)
Application Number:
PCT/JP2021/001902
Publication Date:
August 12, 2021
Filing Date:
January 20, 2021
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D5/16; B32B15/04; C25D5/48; C25D7/06; H05K1/09
Domestic Patent References:
| WO2016117587A1 | 2016-07-28 |
Foreign References:
| JP2005048277A | 2005-02-24 | |||
| JP2001089892A | 2001-04-03 | |||
| JPH11317574A | 1999-11-16 | |||
| JP2014506202A | 2014-03-13 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Download PDF: