Title:
ROUGHENED COPPER FOIL, CARRIER-ATTACHED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/157363
Kind Code:
A1
Abstract:
Provided is a roughened copper foil capable of achieving both excellent high-frequency characteristics and high shear strength from processing of a copper-clad laminate to production of a printed wiring board. This roughened copper foil has a roughened surface on at least one side thereof. The roughened surface has an interface expansion area ratio Sdr of 0.50-7.00%, said interface expansion area ratio being measured in accordance with ISO 25178, under conditions of an S-filter cutoff wavelength of 0.55 μm and an L-filter cutoff wavelength of 10 μm. This roughened copper foil has a peak density Spd of 2.00×104 mm-2 to 3.30×104 mm-2, said peak density being measured in accordance with ISO 25178, under conditions of an S-filter cutoff wavelength of 3.0 μm and an L-filter cutoff wavelength of 10 μm.
Inventors:
HOSOKAWA MAKOTO (JP)
TAKANASHI AKITOSHI (JP)
MIZOGUCHI MISATO (JP)
HIRAOKA SHINYA (JP)
TAKANASHI AKITOSHI (JP)
MIZOGUCHI MISATO (JP)
HIRAOKA SHINYA (JP)
Application Number:
PCT/JP2021/001903
Publication Date:
August 12, 2021
Filing Date:
January 20, 2021
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D7/06
Domestic Patent References:
| WO2016117587A1 | 2016-07-28 |
Foreign References:
| JP2005048277A | 2005-02-24 | |||
| JP2001089892A | 2001-04-03 | |||
| JPH11317574A | 1999-11-16 | |||
| JP2014506202A | 2014-03-13 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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