Title:
ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/018232
Kind Code:
A1
Abstract:
Provided is a roughened copper foil that has good adhesiveness to resin as well as good abrasion resistance in spite of fine projections and recesses thereof having a low roughness suitable for fine-pitch circuit formation and high-frequency applications, and therefore stably exhibits good adhesiveness to resin even after rubbing against something during processing of a copper-clad foil or production of a printed wiring board. The roughened copper foil according to the present invention has a roughened surface having fine projections and recesses comprising acicular crystals and/or tabular crystals on at least one side thereof. The roughened surface has a maximum height Sz, as measured in accordance with ISO25178, of not more than 1.5 µm and an arithmetic mean peak curvature Spc, as measured in accordance with ISO25178, of not more than 1300 mm-1.
Inventors:
TSUYOSHI HIROAKI (JP)
TATEOKA AYUMU (JP)
HOSOKAWA MAKOTO (JP)
TATEOKA AYUMU (JP)
HOSOKAWA MAKOTO (JP)
Application Number:
PCT/JP2016/070876
Publication Date:
February 02, 2017
Filing Date:
July 14, 2016
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C23C26/00; B32B15/20; C25D1/04; H05K1/09
Domestic Patent References:
| WO2014126193A1 | 2014-08-21 | |||
| WO2014081041A1 | 2014-05-30 |
Foreign References:
| JP2015134953A | 2015-07-27 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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