ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD

WIPO Patent Application WO/2022/209990

A1

Provided is a roughened copper foil that has excellent transmission characteristics and suppresses the falling off of powder. This roughened copper foil has a roughened surface on at least one side. The roughened surface has a roughness slope tanθ of 0.58 or less, as calculated by the formula, Rc/(0.5×RSm), on the basis of average height Rc (μm) and average length RSm (μm) of a contour curve element, and has a sharpness index Rc×Sku, which is the product of average height Rc (μm) and kurtosis Sku, of 2.35 or less. Rc and RSm are values measured, in accordance with JIS B0601-2013, without performing cutoff using cutoff value λs and cutoff value λc, and Sku is a value measured, in accordance with ISO 25178, without performing cutoff by an S filter and an L filter.

JP5919345	The manufacturing method of copper foil with a career, the manufacturing method of a copper-clad laminate sheet, the manufacturing method of a printed wired board, the manufacturing method of electronic equipment, copper foil with a career, a copper-clad laminate sheet, a printed wired board, and electronic equipment
JPS5415435	APPARATUS FOR MAKING COPPER FOIL
WO/2023/189565	CARRIER-ATTACHED METAL FOIL, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

TATEOKA AYUMU (TW)
KATO TSUBASA (TW)
KAWAGUCHI SHOTA (JP)
YANG PO CHUN (TW)

PCT/JP2022/012433

October 06, 2022

March 17, 2022

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MITSUI MINING & SMELTING CO LTD (JP)

C25D1/04; B32B15/08; B32B15/20; C25D5/16; C25D7/06; H05K3/18

WO2016117587A1	2016-07-28
WO2018110579A1	2018-06-21

JP2020011426A	2020-01-23
JP2015105421A	2015-06-08

TAKAMURA Masaharu et al. (JP)

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