ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2022/209989

A1

Provided is a roughened copper foil which, when used in a copper-cladded laminate board or a printed wiring board, can achieve both of excellent transmission properties and high peel strength. The roughened copper foil has a roughened surface on at least one side thereof. In the roughened surface, the roughness trend tan θ calculated from the formula Rc/(0.5 × RSm) based on the average height Rc (µm) and the average length RSm (µm) of a contour curve element is 0.58 or less, and the projected area of micro-roughening Rc × RSm, which is the product of the average height Rc (µm) and the average length RSm (µm) of a contour curve element, is 0.45 µm2 to 2.00 µm2. The values of Rc and RSm are measured in accordance with JIS B0601-2013 under conditions of no cutoff by cutoff value λs and cutoff value λc.

WO/2014/024994	COPPER FOIL WITH CARRIER ATTACHED THERETO
JP6254306	Surface treatment copper foil, copper foil with a career, the manufacturing method of a substrate, a manufacturing method of a printed wired board, a manufacturing method of a printed circuit board, a manufacturing method of a copper-clad laminate sheet

TATEOKA AYUMU (TW)
KANEYAMA RYOSUKE (TW)
HARA YASUJI (JP)
SATO YASUO (JP)
OBATA SHINICHI (JP)
LI CHUN CHIEH (TW)

PCT/JP2022/012432

October 06, 2022

March 17, 2022

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MITSUI MINING & SMELTING CO LTD (JP)

C25D1/04; B32B15/08; B32B15/20; C25D5/16; C25D7/06; H05K3/18

WO2016117587A1	2016-07-28
WO2018110579A1	2018-06-21

JP2020011426A	2020-01-23
JP2015105421A	2015-06-08

TAKAMURA Masaharu et al. (JP)

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