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Patent Searching and Data


Title:
RUBBER-TYPE CURABLE HOTMELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2008/004376
Kind Code:
A1
Abstract:
The object is to provide an one-part curable hotmelt adhesive which is free from a concern about ecological problems which are inevitable to a solvent-type curable adhesive, inconvenience in handling which is inevitable to a moisture-curable polyurethane-type hotmelt adhesion or a conventional two-part curable hotmelt adhesive, and such an economical absurdity that an adhesive agent should be discarded before and after the processing. Disclosed is a rubber-type curable hotmelt adhesive. In the adhesive, a reactive composition composed mainly of (A) an acid anhydride-modified copolymer, (B) an epoxy resin, (C) a non-reactive block copolymer, (D) an adhesiveness-imparting agent and (E) a plasticizer is reacted with (F) a cure-promoting agent on the surface of the composition, thereby creating a curing reaction gradient from the surface of the composition toward its inside.

Inventors:
GOTO HIDEO (JP)
SAKAKIBARA RYOHEI (JP)
TOCHIGI EISO (JP)
KAWAGUCHI MASANORI (JP)
CHIBA TAKESHI (JP)
Application Number:
PCT/JP2007/059635
Publication Date:
January 10, 2008
Filing Date:
May 10, 2007
Export Citation:
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Assignee:
YASUHARA CHEMICAL CO LTD (JP)
KANEKA CORP (JP)
GOTO HIDEO (JP)
SAKAKIBARA RYOHEI (JP)
TOCHIGI EISO (JP)
KAWAGUCHI MASANORI (JP)
CHIBA TAKESHI (JP)
International Classes:
C09J153/00; C09J7/02; C09J163/00
Foreign References:
JP2003201459A2003-07-18
JP2003201458A2003-07-18
JP2002235061A2002-08-23
JPH11279521A1999-10-12
JP2000119620A2000-04-25
JPH06145625A1994-05-27
JP2002121501A2002-04-26
JPH02283781A1990-11-21
Attorney, Agent or Firm:
SHIRAI, Shigetaka (8-5 Toranomon 1-chome, Minato-ku Tokyo 01, JP)
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