Title:
SELECTIVE SOLDER BALL-REDUCING NOZZLE APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/097875
Kind Code:
A1
Abstract:
Provided according to the present invention is a selective solder ball-reducing nozzle apparatus comprising: a nozzle body (10) which is placed on a mount (F) mounted on a soldering bath (B), guides a soldering liquid (S) from a central shaft to the top part, and guides a soldering liquid (S'), discharged and flowing down for a soldering work, to flow downward; a nozzle cap (20) placed on the top part of the nozzle body (10) and communicating with the central shaft of the nozzle body (10) to discharge the soldering liquid (S); and a moving portion (30) which is penetrated by the outer circumferential surface of the nozzle body (10) and moves up and down freely on the surface of a soldering liquid (SS) received in the soldering bath (B), along the central shaft of the nozzle body (10).
Inventors:
BAEK CHULHO (KR)
Application Number:
PCT/KR2021/008312
Publication Date:
May 12, 2022
Filing Date:
June 30, 2021
Export Citation:
Assignee:
T AND I TECK CO LTD (KR)
International Classes:
B23K3/06; B23K1/00; B23K101/36
Domestic Patent References:
| WO2010073739A1 | 2010-07-01 |
Foreign References:
| KR20170070848A | 2017-06-22 | |||
| JP3193699U | 2014-10-16 | |||
| KR102116762B1 | 2020-05-29 | |||
| KR101996146B1 | 2019-07-11 | |||
| KR102242585B1 | 2021-04-19 |
Attorney, Agent or Firm:
SEO, Dongwon (KR)
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