Title:
SEMIAROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED BODY FORMED BY MOLDING SAME
Document Type and Number:
WIPO Patent Application WO/2014/148519
Kind Code:
A1
Abstract:
Provided is a semiaromatic polyamide resin composition containing a semiaromatic polyamide (A), a phosphorous flame retardant (B), and an inorganic aluminum compound (C), wherein the semiaromatic polyamide resin composition is characterized by the following: the mass ratio (A/B) of (A) and (B) is 50/50 to 95/5; there are 0.1 to 20 parts by mass of (C) relative to a total 100 parts by mass of (A) and (B) combined; (A) is constituted of an aromatic dicarboxylic acid component, an aliphatic diamine component, and a monocarboxylic acid component; and the amount of the monocarboxylic acid component contained is 0.3 to 4.0 mol% relative to the total monomer components constituting (A).
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Inventors:
MII JUNICHI
TAKETANI YUTAKA
AMARI TAIYO
KAMIKAWA HIROO
KABASHIMA YOHEI
TAKETANI YUTAKA
AMARI TAIYO
KAMIKAWA HIROO
KABASHIMA YOHEI
Application Number:
PCT/JP2014/057433
Publication Date:
September 25, 2014
Filing Date:
March 19, 2014
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
C08L77/06; C08K3/10; C08K5/5313; C08K7/02
Domestic Patent References:
| WO2013042541A1 | 2013-03-28 |
Foreign References:
| JP2012528904A | 2012-11-15 | |||
| JP2011526940A | 2011-10-20 | |||
| JP2009263503A | 2009-11-12 | |||
| JP2009270107A | 2009-11-19 | |||
| JP2013064032A | 2013-04-11 | |||
| JP2014101494A | 2014-06-05 | |||
| JP2004263188A | 2004-09-24 | |||
| JP2007023206A | 2007-02-01 | |||
| JP2010254760A | 2010-11-11 |
Other References:
See also references of EP 2977411A4
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
Patent business corporation Morimoto international patent firm (JP)
Patent business corporation Morimoto international patent firm (JP)
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