Title:
SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/129696
Kind Code:
A1
Abstract:
Provided are a semiconductor component and a manufacturing method therefor. The semiconductor component comprises a substrate (106), a bonding metal layer (105), a reflective layer (104), a first conductive layer (101), an active layer (102), a second conductive layer (103), a first electrode (107), and a second electrode (108). The first electrode (107) sequentially runs through the substrate (106), the bonding metal layer (105), the reflective layer (104), the second conductive layer (103) and the active layer (102) from one side of the substrate (106) distant from the bonding metal layer (105), extends to the first conductive layer (101), and is connected to the first conductive layer (101). The second electrode (108) is disposed on one side of the substrate (106) distant from the bonding metal layer (105). A structure for sharing the second conductive layer (103) is formed to enable light from the semiconductor component to be more uniform, the light extraction efficiency is higher, interference among pixel units is eliminated, the light-emitting wavelength is more uniform, and a current flowing through different pixel units is more uniform.
Inventors:
ZHANG LIYANG (CN)
Application Number:
PCT/CN2017/070987
Publication Date:
July 19, 2018
Filing Date:
January 12, 2017
Export Citation:
Assignee:
ENKRIS SEMICONDUCTOR INC (CN)
International Classes:
H01L33/00; H01L27/15
Foreign References:
| CN104064641A | 2014-09-24 | |||
| US9059339B1 | 2015-06-16 | |||
| CN102339913A | 2012-02-01 | |||
| CN101026211A | 2007-08-29 | |||
| CN203826419U | 2014-09-10 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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