Title:
SEMICONDUCTOR DEVICE AND ANTENNA DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/115830
Kind Code:
A1
Abstract:
A semiconductor device 100 according to the present invention comprises: a first metal body 10 which has a semiconductor element 1 and a die pad portion 11 on which the semiconductor element 1 is mounted, and in which the semiconductor element 1 is mounted on a die bonding surface 12 of the die pad portion 11; a second metal body 20 which has a wire bond pad portion 32 connected to a signal electrode of the semiconductor element 1 by a wire 3, which is arranged under the first metal body 10 on the same side as the die bonding surface 12 while being separated from the first metal body 10, and which forms a transmission line together with the first metal body 10; and a mold resin 2 which holds the first metal body 10 and the second metal body 20 so that the surface of the first metal body 10 opposite to the die bonding surface 12 is exposed.
More Like This:
Inventors:
ICHINOHE HIROAKI (JP)
MATSUSUE AKIHIRO (JP)
MATSUSUE AKIHIRO (JP)
Application Number:
PCT/JP2018/044670
Publication Date:
June 11, 2020
Filing Date:
December 05, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/02; H01L23/08; H01L23/28; H01L23/29; H01L23/50
Foreign References:
| JPH0697359A | 1994-04-08 | |||
| JPH10173117A | 1998-06-26 | |||
| JP2015211056A | 2015-11-24 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
Download PDF:
Previous Patent: PRESSURE FEED MEANS AND PRESSURE FEED SYSTEM
Next Patent: PROTECTIVE CLOTHING AND SHOE COVER
Next Patent: PROTECTIVE CLOTHING AND SHOE COVER