SEMICONDUCTOR DEVICE, AND ON-BOARD POWER CONVERSION DEVICE

Title:

SEMICONDUCTOR DEVICE, AND ON-BOARD POWER CONVERSION DEVICE

Document Type and Number:

WIPO Patent Application WO/2013/080317

Kind Code:

A1

Abstract:

The purpose of the present invention is to obtain a semiconductor device capable of both improving the heat dissipation of a heat-generating element, and reducing the mounting area for a mounting substrate. This semiconductor device comprises: the heat-generating element (1) connected via a terminal (1a) extending in the vertical direction relative to the mounting substrate (5); a heat-dissipating member (2) having an element-contact section (2a) in surface-contact with an attachment surface (1e) for this heat-generating element (1), via a heat-dissipating sheet (7); a first pressing member (3) and a second pressing member (4) that come in contact with the heat-generating element (1), and press the heat-generating element (1) on to the heat-dissipating member (2); and a fixing screw (6) that fixes the first pressing member (3) to the heat-dissipating member (2) through a through-hole (3c) formed in the first pressing member (3) parallel to the attachment surface (1e). Sloping surfaces are formed in the first pressing member (3) and the second pressing member (4), whereby the axial force component of the tightening force of the fixing screw (6) is generated in the vertical direction relative to the attachment surface (1e).

Inventors:

KODAMA KATSUHISA (JP)

Application Number:

PCT/JP2011/077620

Publication Date:

June 06, 2013

Filing Date:

November 30, 2011

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)
KODAMA KATSUHISA (JP)

International Classes:

H01L23/40; H05K7/20

Foreign References:

JP2000091485A	2000-03-31
JP2005183644A	2005-07-07
JP2007053295A	2007-03-01
JP2008147306A	2008-06-26
JPH09134985A	1997-05-20
JP2001332670A	2001-11-30
JP2002198477A	2002-07-12
JP2011082344A	2011-04-21

Other References: