Title:
SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/054482
Kind Code:
A1
Abstract:
An array substrate (11b) is provided with: a first diode (29) provided with at least a first semiconductor part (29d) which has, in a planar view, an outer edge (29d1) intersecting outer edges (29a1, 29b1) of first electrode parts (29a, 29b); common wiring (25) comprising a first metal film (34); first short-circuit wiring parts (31) which comprise a second metal film (38), and which intersect the common wiring (25); and a static-electricity protection part (51) which comprises the second metal film (38) or a protective film (37), which has, in a planar view, at least a portion thereof superposing the common wiring (25), which is disposed relatively closer to the first diode (29) than regions (CPT) where the common wiring (25) and the first short-circuit wiring parts (31) intersect, and which is provided with at least a static-electricity attraction member (52) for attracting static electricity.
Inventors:
NAKATA YUKINOBU
MAEDA MASAKI
MAEDA MASAKI
Application Number:
PCT/JP2013/075853
Publication Date:
April 10, 2014
Filing Date:
September 25, 2013
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
G09F9/30; G02F1/1368; G09F9/00; H01L21/822; H01L27/04; H01L29/786
Domestic Patent References:
| WO2008078426A1 | 2008-07-03 |
Foreign References:
| JPH1195253A | 1999-04-09 | |||
| JP2002176139A | 2002-06-21 | |||
| JPH11194368A | 1999-07-21 | |||
| JP2010230744A | 2010-10-14 |
Other References:
See also references of EP 2905768A4
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
Patent business corporation dawn joint patent firm (JP)
Patent business corporation dawn joint patent firm (JP)
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