Title:
SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/162713
Kind Code:
A1
Abstract:
Provided is a semiconductor device which exhibits improved semiconductor element compactness and manufacturing cost reduction, and eliminates defects caused by separation at the interface between resins. A semiconductor device equipped with a substrate, a semiconductor element provided on the substrate, a connecting member for electrically connecting the substrate and the semiconductor element, a transparent member provided to the semiconductor element on the side thereof opposite the substrate side, and a sealing resin part for supporting the transparent member against the substrate, sealing the periphery between the substrate and the transparent member, and together with the semiconductor element and the transparent member, forming a cavity between said semiconductor element and said transparent member, wherein the semiconductor element has, on the surface side thereof, a resin-restricting part which restricts the intrusion into the inside of the semiconductor element of the resin material which forms the sealing resin part.
Inventors:
HAMAGUCHI SHINGO (JP)
KANATAKE MITSUHITO (JP)
KANATAKE MITSUHITO (JP)
Application Number:
PCT/JP2023/004508
Publication Date:
August 31, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/02; H01L27/146; H01L23/28
Domestic Patent References:
| WO2019087700A1 | 2019-05-09 |
Foreign References:
| JP2020510991A | 2020-04-09 | |||
| JP2016027586A | 2016-02-18 | |||
| JP2006108285A | 2006-04-20 | |||
| US20200312897A1 | 2020-10-01 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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