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Title:
SUBSTRATE POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/162714
Kind Code:
A1
Abstract:
The present invention pertains to a substrate polishing device for polishing a substrate such as a wafer, and particularly to a substrate polishing device for polishing a notch section of the substrate, a bevel section of the substrate, a device surface of the substrate, and the back surface of the substrate. This substrate polishing device includes a first polishing module, a second polishing module, and a third polishing module, and the first polishing module, the second polishing module, and the third polishing module are polishing modules respectively polishing different areas of the substrate.

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Inventors:
YAZAWA AKIHIRO (JP)
KOBAYASHI KENICHI (JP)
OHASHI HIROTAKA (JP)
ISHIKAWA SHO (JP)
KASHIWAGI MAKOTO (JP)
MIYASAWA YASUYUKI (JP)
Application Number:
PCT/JP2023/004509
Publication Date:
August 31, 2023
Filing Date:
February 10, 2023
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B24B9/00; B24B21/00; B24B49/10
Foreign References:
JP2007194612A2007-08-02
JP2014150178A2014-08-21
JP2010125488A2010-06-10
JP2018174230A2018-11-08
JP2014061580A2014-04-10
JP2020088323A2020-06-04
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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