Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/210329
Kind Code:
A1
Abstract:
Provided is a semiconductor device capable of detecting failure of a bonding portion between semiconductor substrates. This semiconductor device comprises: first and second semiconductor substrates stacked and bonded together; a connection wire that has a plurality of pairs of connection pads connected to each other with an interface of the substrates therebetween, and that is routed from one of the first and second semiconductor substrates to the other alternately a plurality of times via the pairs of connection pads; and a detection circuit capable of detecting the presence or absence of failure in the connection wire. The connection wire includes a wiring member connecting the connection pads that are adjacent to each other on each of the first and second semiconductor substrate sides. The wiring member includes a horizontal wiring part extending in the horizontal direction, and a vertical wiring part extending in a stacking direction and connecting the connection pads to the horizontal wiring part. The connection wire comprises a plurality of lines of connection wires, including a first connection wire and a second connection wire electrically separated from the first connection wire. The first connection wire includes M vertical wiring parts for each connection pad, and the second connection wire includes N vertical wiring parts for each connection pad, where M > N.
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Inventors:
TAKEUCHI KEITA (JP)
YAMAMOTO SATOSHI (JP)
YAMAMOTO SATOSHI (JP)
Application Number:
PCT/JP2023/014587
Publication Date:
November 02, 2023
Filing Date:
April 10, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/66; G01R31/28; H01L21/02; H01L21/3205; H01L21/768; H01L21/822; H01L23/522; H01L27/04; H04N25/70
Domestic Patent References:
| WO2021171785A1 | 2021-09-02 |
Foreign References:
| JP2022050238A | 2022-03-30 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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