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Patent Searching and Data


Title:
MEASURING METHOD OF IC
Document Type and Number:
Japanese Patent JPH03104137
Kind Code:
A
Abstract:

PURPOSE: To improve measuring efficiency of electric characteristics by inserting the lead of an IC retained by an IC retaining part and the contacter of a measuring instrument into a through hole to connect them, and measuring the IC.

CONSTITUTION: When an IC retaining part 2 comes on a measuring socket 6, a positioning pin engages with a perforation 8, and accurately positions the retaining part 2 and further an IC 9 on the retaining part 2, with respect to the socket 6. In this case, the lead 10 of the IC 9 and a contactor 7 of the locket 6 come into contact with each other through a through hole 5 of an embossed tape 1. In order to reduce the contact resistance, the part of the lead 10 coming into contact with the contactor 7 is pressed from above by using a contact chip 11 composed of ceramic, and measurement is performed in this state. When the measurement is ended, the chip 11 is made to ascend, the lead 10 is released, the tape 1 is shifted by the pitch amount of an IC retaining part arrangement; the next retaining part 2 is positioned on the socket 6, and the next IC 9 is measured. Thereby the time required for measurement can be reduced.


Inventors:
KAMEDA MASAYUKI
Application Number:
JP24161289A
Publication Date:
May 01, 1991
Filing Date:
September 18, 1989
Export Citation:
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Assignee:
SONY CORP
International Classes:
H01L21/66; (IPC1-7): H01L21/66
Attorney, Agent or Firm:
Hideaki Ogawa