Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/140072
Kind Code:
A1
Abstract:
The present disclosure relates to a semiconductor device and an electronic device in which fluctuations and deterioration in transistor characteristics can be decreased. A first connection pad having a first wire connected thereto and a first floating metal that is larger than the first connection pad are formed on a bonding surface of a first substrate. A second connection pad having a second wire connected thereto and a second floating metal that is larger than the second connection pad are formed on a bonding surface of a second substrate. The first connection pad is connected to the second floating metal, the second floating metal is connected to the first floating metal, and the first floating metal is connected to the second connection pad. The first floating metal and the second floating metal that are formed on the first substrate and the second substrate, respectively, are bonded to each other. The present disclosure can be applied to, for example, a CMOS solid-state imaging device used for an imaging device such as a camera.
Inventors:
ANDO YUKIHIRO (JP)
Application Number:
PCT/JP2016/054724
Publication Date:
September 09, 2016
Filing Date:
February 18, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/146; H01L21/02; H01L21/3205; H01L21/768; H01L23/522; H04N5/369
Foreign References:
| US20140273347A1 | 2014-09-18 | |||
| JP2002280448A | 2002-09-27 | |||
| JP2014022561A | 2014-02-03 | |||
| JP2012244101A | 2012-12-10 | |||
| JP2009055004A | 2009-03-12 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)
Nishikawa 孝 (JP)
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