Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/095420
Kind Code:
A1
Abstract:
The present invention provides a semiconductor device which has further stabilized quality by performing efficient evaluation or sufficient evaluation. The present invention provides a semiconductor device which is provided with a substrate and at least one chip that is bonded to the substrate, wherein: the substrate as a first bonding surface that is boned to the at least one chip; the at least one chip has a second bonding surface that is bonded to the substrate; a first dummy metal is arranged on the first bonding surface; a second dummy metal is arranged on the second bonding surface; and a chain structure is formed by connecting a part of the first dummy metal and a part of the second dummy metal to each other via the first bonding surface and the second bonding surface, so that the first dummy metal or the second dummy metal is electrically connected to a connection part which is formed in the at least one chip or the substrate, said connection part being connected to an external terminal.
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Inventors:
OKANO HITOSHI (JP)
Application Number:
PCT/JP2020/038608
Publication Date:
May 20, 2021
Filing Date:
October 13, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/3205; G01R31/26; G01R31/28; H01L21/768; H01L21/822; H01L21/8234; H01L23/522; H01L27/04; H01L27/06; H01L27/088; H01L27/146
Domestic Patent References:
| WO2016056409A1 | 2016-04-14 | |||
| WO2017169505A1 | 2017-10-05 |
Foreign References:
| JP2018101699A | 2018-06-28 | |||
| JP2012164870A | 2012-08-30 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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