Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/172673
Kind Code:
A1
Abstract:
High heat dissipation is achieved with a simple and inexpensive structure in this semiconductor device that is configured to include a semiconductor element provided in a cavity of a cavity substrate mounted on a main substrate. The semiconductor device comprises: a main substrate; a cavity substrate that has a cavity formed in the back surface being a plate surface on the main substrate side, and that is mounted on the main substrate; and a semiconductor element that is positioned in the cavity, that is mounted on the cavity substrate, and that is metal-joined to the main substrate by causing one surface of the semiconductor element, the one surface being on the main substrate side, to be positioned on the same or substantially the same plane as that of the back surface of the cavity substrate.
Inventors:
INOMOTO RYO (JP)
SAKAI KIYOHISA (JP)
YASUKAWA HIROHISA (JP)
SAKAI KIYOHISA (JP)
YASUKAWA HIROHISA (JP)
Application Number:
PCT/JP2022/000687
Publication Date:
August 18, 2022
Filing Date:
January 12, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/12; H01L23/32; H01L23/36; H01L25/065; H01L25/07; H01L25/18; H05K1/18
Foreign References:
| JPH1050926A | 1998-02-20 | |||
| JPH1140608A | 1999-02-12 | |||
| JP2007157784A | 2007-06-21 | |||
| JP2005260385A | 2005-09-22 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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