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Title:
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE, METHOD FOR MANUFACTURING SAME, LAMINATED FILM FOR FORMING SUPPORT PIECE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/217401
Kind Code:
A1
Abstract:
A laminated film for forming a support piece according to this disclosure is provided with, in this order, a base material film, a pressure-sensitive adhesive layer, and a support piece-forming film, wherein the support piece-forming film has a multilayer structure including at least a metal layer. The laminated film for forming a support piece is applied in a process for manufacturing a semiconductor device having a dolmen structure comprising a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip on the substrate, and a second chip which is supported by the plurality of support pieces and disposed so as to cover the first chip.

Inventors:
YAHATA TATSUYA (JP)
TANIGUCHI KOUHEI (JP)
HASHIMOTO SHINTARO (JP)
OZAKI YOSHINOBU (JP)
ITAGAKI KEI (JP)
Application Number:
PCT/JP2019/017701
Publication Date:
October 29, 2020
Filing Date:
April 25, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L25/065; H01L25/07; H01L25/18
Foreign References:
US7859119B12010-12-28
JP2016216562A2016-12-22
JP2006005333A2006-01-05
JP2003124433A2003-04-25
JP2017515306A2017-06-08
JP2002222889A2002-08-09
US20070181990A12007-08-09
JP2015176906A2015-10-05
US20080029885A12008-02-07
US20130270717A12013-10-17
JP2013131557A2013-07-04
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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