Title:
SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND SEMICONDUCTOR DEVICE INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/083904
Kind Code:
A1
Abstract:
This semiconductor device inspection apparatus inspects a semiconductor device to be inspected on the basis of a result signal outputted in accordance with the input of a test pattern signal to the semiconductor device, and comprises: an ultrasonic transducer which is arranged opposite to the semiconductor device and which generates ultrasonic waves; a stage which moves the relative position of the semiconductor device and the ultrasonic transducer; a stimulation condition control unit which controls a condition of stimulation by the ultrasonic waves applied to the semiconductor device; and an analysis unit which generates a measurement image on the basis of the result signal outputted from the semiconductor device.
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Inventors:
MATSUMOTO TORU (JP)
SHIMASE AKIRA (JP)
SHIMASE AKIRA (JP)
Application Number:
PCT/JP2017/033944
Publication Date:
May 11, 2018
Filing Date:
September 20, 2017
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
G01R31/302; G01R31/26
Foreign References:
| JPH08320359A | 1996-12-03 | |||
| JP2008102071A | 2008-05-01 | |||
| JP2016057187A | 2016-04-21 | |||
| JPH11304769A | 1999-11-05 | |||
| JP2010032295A | 2010-02-12 | |||
| JP2011053126A | 2011-03-17 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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