Title:
SEMICONDUCTOR DEVICE INSPECTION METHOD AND SEMICONDUCTOR DEVICE INSPECTION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/061378
Kind Code:
A1
Abstract:
Provided is a semiconductor device inspection method for inspecting a semiconductor device, i.e., an object to be inspected, the method including: a step for inputting a stimulus signal to the semiconductor device; a step for obtaining a detection signal corresponding to the response of the semiconductor device to which the stimulus signal has been inputted; a step for generating, on the basis of the detection signal and a reference signal generated on the basis of the stimulus signal, a first in-phase image and first orthogonal image including amplitude information and phase information for the detection signal; and a step for applying a noise-reducing filter process to the first in-phase image and/or first orthogonal image, followed by generating a first amplitude image on the basis of the first in-phase image and the first orthogonal image.
Inventors:
NAKAMURA TOMONORI (JP)
OTAKA AKIHIRO (JP)
OTAKA AKIHIRO (JP)
Application Number:
PCT/JP2017/024519
Publication Date:
April 05, 2018
Filing Date:
July 04, 2017
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
G01R31/302; G01N21/00; G01N21/17; H01L21/66
Domestic Patent References:
| WO2016129458A1 | 2016-08-18 |
Foreign References:
| JP2015145883A | 2015-08-13 | |||
| JP2007064975A | 2007-03-15 | |||
| JP2009541728A | 2009-11-26 |
Other References:
See also references of EP 3521845A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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