SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ADHESIVE USED THEREIN

WIPO Patent Application WO/2022/102181

A1

Disclosed is a manufacturing method for a semiconductor device in which a first and a second member are connected via an adhesive layer, and connecting parts of the first and second members are connected to each other. The manufacturing method comprises: a pre-bonding step in which the first and second members are pre-bonded via a heat-curable adhesive for forming the adhesive layer, thereby obtaining a pre-bonded body; a pre-bonded body pressing step in which the pre-bonded body is pressed in a pressurized atmosphere, thereby obtaining a pressed pre-bonded body; and a main bonding step in which the first and second members in the pressed pre-bonded body are bonded, causing the connecting parts thereof to connect to each other, thereby obtaining a bonded body. In the pre-bonding step, pre-bonding of the first and second members is carried out at a temperature lower than the melting point of the connecting parts. In the pre-bonded body pressing step, the pressing of the pre-bonded body is carried out a temperature lower than the melting point of the connecting parts. In the main bonding step, heating of the pressed pre-bonded body is carried out at a temperature which is at least the melting point of the connecting parts.

UENO KEIKO (JP)
TAIRA AYAKO (JP)
SATO MAKOTO (JP)

PCT/JP2021/029407

May 19, 2022

August 06, 2021

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SHOWA DENKO MATERIALS CO LTD (JP)

C09J11/06; C09J7/00; C09J7/30; C09J11/08; C09J163/00; C09J201/00; H01L21/60; H01L23/29; H01L23/31

WO2018194156A1

2018-10-25

JP2016072400A	2016-05-09
JP2008144021A	2008-06-26

HASEGAWA Yoshiki et al. (JP)

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