Title:
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2020/213167
Kind Code:
A1
Abstract:
A highly reliable semiconductor device can be obtained. This semiconductor device is provided with a semiconductor element (11), a busbar (12), a connection conductor (13) and a wire (14). The semiconductor element (11) includes an electrode (21) formed on a first surface (11a). The busbar (12) is arranged on the electrode (21). The connection conductor (13) connects the electrode (21) and the busbar (12). The wire (14) surrounds the connection conductor (13) and contacts the end of the electrode (21). The wire (14) is fixed to the semiconductor element (11) in at least one region outside of the electrode (21). The wire is configured such that the distance between the surface of the wire (14) and the surface of the electrode (21) increases from the area of connection between the wire (14) and the electrode (21) towards the center of the electrode (21). At least part of the outer periphery of the connection conductor (13) contacts the aforementioned surface of the wire (14) and the aforementioned surface of the electrode (21).
Inventors:
KAWAMURA YUKI (JP)
ABE RYOSUKE (JP)
ABE RYOSUKE (JP)
Application Number:
PCT/JP2019/016873
Publication Date:
October 22, 2020
Filing Date:
April 19, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/60; H01L23/48
Domestic Patent References:
| WO2018179023A1 | 2018-10-04 | |||
| WO2015107871A1 | 2015-07-23 | |||
| WO2018020640A1 | 2018-02-01 |
Foreign References:
| JP2012138470A | 2012-07-19 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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