Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, TEMPLATE SUBSTRATE, SEMICONDUCTOR DEVICE, ELECTRONIC EQUIPMENT, AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/008458
Kind Code:
A1
Abstract:
This semiconductor device manufacturing method comprises: a step for preparing a main substrate, a base semiconductor part formed above the main substrate, and a compound semiconductor part formed on the base semiconductor part; and a step for separating the base semiconductor part and the compound semiconductor part so as to form a resonator surface on at least the compound semiconductor part, and separating the base semiconductor part and the compound semiconductor part into a plurality of element parts.
Inventors:
MURAKAWA KENTARO (JP)
KAMIKAWA TAKESHI (JP)
KAWAGUCHI YOSHINOBU (JP)
KAMIKAWA TAKESHI (JP)
KAWAGUCHI YOSHINOBU (JP)
Application Number:
PCT/JP2022/028868
Publication Date:
February 02, 2023
Filing Date:
July 27, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01S5/02; H01S5/343
Domestic Patent References:
| WO2020262560A1 | 2020-12-30 |
Foreign References:
| JP2012019165A | 2012-01-26 | |||
| JP2005191547A | 2005-07-14 | |||
| JP2020536372A | 2020-12-10 | |||
| JP2008305911A | 2008-12-18 | |||
| JP2006165407A | 2006-06-22 | |||
| JPH10107380A | 1998-04-24 | |||
| JP2008252069A | 2008-10-16 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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