Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS COMPRISING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/082405
Kind Code:
A1
Abstract:
Disclosed are a semiconductor device and a manufacturing method thereof, and an electronic apparatus comprising the semiconductor device. The semiconductor device comprises: a substrate (1001), and a first device and a second device sequentially arranged in a stacked manner on the substrate (1001). Each of the first device and the second device comprises: a first source/drain layer (1003, 1007-2), trench layers (1005, 1009) and a second source/drain layer (1007-1, 1011) sequentially arranged in a stacked manner from bottom to top, and gate stacks (1029/1031, 1045/1047) formed around at least part of the periphery of the trench layers (1005 and 1009). Side walls of the respective trench layers (1005, 1009) of the first device and the second device at least partially extend along different crystal faces or crystal face clusters.
Inventors:
ZHU HUILONG (US)
Application Number:
PCT/CN2018/113049
Publication Date:
April 30, 2020
Filing Date:
October 31, 2018
Export Citation:
Assignee:
INST OF MICROELECTRONICS CAS (CN)
International Classes:
H01L27/092; H01L21/8238
Foreign References:
| CN106252352A | 2016-12-21 | |||
| CN101379609A | 2009-03-04 | |||
| CN107887387A | 2018-04-06 | |||
| JPH0878533A | 1996-03-22 |
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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