Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE COMPRISING SAID SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/082406
Kind Code:
A1
Abstract:
Disclosed are a semiconductor device and a manufacturing method therefor, and an electronic device comprising the semiconductor device. The semiconductor device comprises: a substrate; and a first device and a second device formed on the substrate, the first device and the second device each comprising: a first source/drain layer, a channel layer, and a second source/drain layer sequentially stacked on the substrate from bottom to top, and a gate stack formed around at least a part of the periphery of the channel layer; at least a part of the respective sidewalls of the channel layers of the first device and the second device extends along different crystal planes or crystal plane families.
Inventors:
ZHU HUILONG (US)
ZHANG YONGKUI (CN)
YIN XIAOGEN (CN)
LI CHEN (CN)
LIU YONGBO (CN)
JIA KUNPENG (CN)
ZHANG YONGKUI (CN)
YIN XIAOGEN (CN)
LI CHEN (CN)
LIU YONGBO (CN)
JIA KUNPENG (CN)
Application Number:
PCT/CN2018/113052
Publication Date:
April 30, 2020
Filing Date:
October 31, 2018
Export Citation:
Assignee:
INST OF MICROELECTRONICS CAS (CN)
International Classes:
H01L21/8238; H01L27/092
Foreign References:
| US20100207172A1 | 2010-08-19 | |||
| US20100207172A1 | 2010-08-19 | |||
| CN107887384A | 2018-04-06 | |||
| CN101404321A | 2009-04-08 | |||
| US9882025B1 | 2018-01-30 |
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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