Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2014/091545
Kind Code:
A1
Abstract:
A transistor (18) which has an electrode (3) connected to a semiconductor substrate (1) is provided on the semiconductor substrate (1). A temperature sensing diode (4) which monitors the temperature of the semiconductor substrate (1) is provided on the semiconductor substrate (1). A temperature sensing pad (5) electrically connected to the temperature sensing diode (4) is provided on the semiconductor substrate (1) with an insulating film (20) interposed therebetween. Multiple trenches (21) are provided in the semiconductor substrate (1) below the temperature sensing pad (5).
Inventors:
OSAGA TSUYOSHI (JP)
HARUGUCHI HIDEKI (JP)
HARUGUCHI HIDEKI (JP)
Application Number:
PCT/JP2012/081980
Publication Date:
June 19, 2014
Filing Date:
December 10, 2012
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
OSAGA TSUYOSHI (JP)
HARUGUCHI HIDEKI (JP)
OSAGA TSUYOSHI (JP)
HARUGUCHI HIDEKI (JP)
International Classes:
H01L27/04; H01L29/78
Domestic Patent References:
| WO2010109596A1 | 2010-09-30 |
Foreign References:
| JP2002009284A | 2002-01-11 | |||
| JP2005340347A | 2005-12-08 | |||
| JP2011249491A | 2011-12-08 | |||
| JP2011204803A | 2011-10-13 | |||
| JPS63229758A | 1988-09-26 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
Takada 守 (JP)
Takada 守 (JP)
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