Title:
SOLDER PRINTING MACHINE
Document Type and Number:
WIPO Patent Application WO/2014/091546
Kind Code:
A1
Abstract:
A solder printing machine is provided with an apparatus (112) for managing replaceable working devices such as a screen (16), a squeegee (20), and a substrate holder (59) and is constituted so as to have functions (114, 116, 118) for determining the suitability of working devices attached to the solder printing machine on the basis of information concerning working devices that should be attached and information concerning working devices that are actually attached. The suitability of the working devices that are attached can be confirmed in this solder printing machine; therefore, the practicability of this solder printing machine is high. Moreover, information concerning working devices that are actually attached can be obtained on the basis of identification information indicated by identifiers (88, 90, 92) assigned to the working devices.
Inventors:
SUZUKI SEIGO (JP)
KATO MITSUAKI (JP)
KATO MITSUAKI (JP)
Application Number:
PCT/JP2012/081983
Publication Date:
June 19, 2014
Filing Date:
December 10, 2012
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H05K3/34; B41F15/00
Foreign References:
| JP2004230785A | 2004-08-19 | |||
| JP2012232536A | 2012-11-29 | |||
| JP2004281717A | 2004-10-07 | |||
| JP2008049669A | 2008-03-06 | |||
| JP2012086432A | 2012-05-10 | |||
| JP2012196824A | 2012-10-18 |
Attorney, Agent or Firm:
CHUBU PATENT OFFICE (JP)
Central patent business corporation international patent firm (JP)
Central patent business corporation international patent firm (JP)
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