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Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209819
Kind Code:
A1
Abstract:
This semiconductor device includes a semiconductor element, a first lead, a second lead, and a first wire. The rear surface of a bonding pad is disposed on the side on which the main surface of a die pad is located with respect to the rear surface of the die pad in a z direction. The first wire is bonded to a first electrode and the main surface of the bonding pad. A bonding pad part has only a single first portion. The first portion extends to the rear surface of the bonding pad, is surrounded by the rear surface of the bonding pad when viewed in the z direction, and includes a portion that is present at a different location than the rear surface of the bonding pad in the z direction.

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Inventors:
FUTAMURA YOSUI (JP)
MIKAMI SHUNYA (JP)
Application Number:
PCT/JP2022/011312
Publication Date:
October 06, 2022
Filing Date:
March 14, 2022
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/50; H01L21/60
Foreign References:
JP2005166943A2005-06-23
JP2003017524A2003-01-17
JP2001185671A2001-07-06
JP2001339029A2001-12-07
JPH05175266A1993-07-13
JP2008130660A2008-06-05
JP2001168261A2001-06-22
JP2005191240A2005-07-14
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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