Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/051182
Kind Code:
A1
Abstract:
This semiconductor device is provided with: an expanded semiconductor chip (3), which has a first semiconductor chip (1a) and an expanded portion (2) formed toward the outside from a side surface of the first semiconductor chip (1a); a second semiconductor chip (1b), which is provided to be connected to the expanded semiconductor chip (3) via a plurality of first bumps (4a); and a base (5), which is provided to be connected to the expanded semiconductor chip (3) via a plurality of second bumps (4b). The first bumps (4a) are formed between the first semiconductor chip (1a) and the second semiconductor chip (1b), and the second bumps (4b) are formed between the expanded portion (2) and the base (5).
Inventors:
DOHI SHIGEFUMI
HAGIHARA KIYOMI
HAGIHARA KIYOMI
Application Number:
PCT/JP2012/005359
Publication Date:
April 11, 2013
Filing Date:
August 27, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
DOHI SHIGEFUMI
HAGIHARA KIYOMI
DOHI SHIGEFUMI
HAGIHARA KIYOMI
International Classes:
H01L25/04; H01L23/12; H01L25/18
Foreign References:
| JP2006203079A | 2006-08-03 | |||
| JP2005093943A | 2005-04-07 | |||
| JP2007053395A | 2007-03-01 | |||
| JP2004146728A | 2004-05-20 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Download PDF:
Claims:
Previous Patent: INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND COMPUTER PROGRAM
Next Patent: WORKPIECE CUTTING METHOD AND WIRE SAW
Next Patent: WORKPIECE CUTTING METHOD AND WIRE SAW