SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2014/006682

A1

Firstly, a plurality of through holes (5) are formed from the upper surface of the conductive board (4) toward the lower surface thereof. Then, the conductive board (4) wrapped with a solder (6) is inserted into between an electrode (2) of a semiconductor element (1) and a metal frame (3). Then, the electrode (2) and the metal frame (3) are bonded to each other by heating the electrode and the metal frame with the solder (6) and the conductive board (4) therebetween. In such a manner, since the least necessary thickness of the solder (6) can be ensured by inserting the conductive board (4) into between the electrode (2) of the semiconductor element (1) and the metal frame (3), dimensional tolerance of the thickness of the solder (6) can be reduced. Furthermore, the solder (6) is not excessively supplied by adjusting the quantity of the solder (6) to wrap the conductive board (4), and a suitable quantity of the solder can be supplied even to the small semiconductor element (1).

KAWASE TATSUYA (JP)
ISHIHARA MIKIO (JP)
SASAKI TAISHI (JP)
TAKAYAMA TSUYOSHI (JP)
KATO HAJIME (JP)

PCT/JP2012/066917

January 09, 2014

July 02, 2012

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MITSUBISHI ELECTRIC CORP (JP)
KAWASE TATSUYA (JP)
ISHIHARA MIKIO (JP)
SASAKI TAISHI (JP)
TAKAYAMA TSUYOSHI (JP)
KATO HAJIME (JP)

H01L21/52; B23K1/19; B23K1/20; H01L21/60; H01L23/48; H01L23/50

JP2004047663A	2004-02-12
JP2009267054A	2009-11-12
JP2012054328A	2012-03-15
JPH05251827A	1993-09-28
JPH03218031A	1991-09-25

TAKADA, Mamoru et al. (JP)
Takada 守 (JP)

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