Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/135852
Kind Code:
A1
Abstract:
This semiconductor device is provided with a substrate (1A), beam (12), movable structure (13), first stopper member (S1), second stopper member (S2), and third stopper member (S3). The first stopper member (S1) is disposed by having a first gap (T1) between the movable structure (13) and the first stopper member in the in-plane direction. The second stopper member (S2) is disposed by having a second gap (T2) between the movable structure (13) and the second stopper member in the out-of-plane direction. The third stopper member (S3) is disposed on the side of the movable structure (13) in the out-of-plane direction, said side being the opposite side to the second stopper member (S2), by having a third gap (T3) between the movable structure (13) and the third stopper member. Consequently, the semiconductor device wherein damages and breakage of the beam that supports the movable structure are suppressed by suppressing excessive displacement of the movable structure, and a method for manufacturing the semiconductor device can be provided.
Inventors:
OKUMURA MIKA (JP)
Application Number:
PCT/JP2015/055211
Publication Date:
September 01, 2016
Filing Date:
February 24, 2015
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01P15/08; G01P15/125
Foreign References:
| JP2008139282A | 2008-06-19 | |||
| JP2006153518A | 2006-06-15 | |||
| JP2004223713A | 2004-08-12 | |||
| JPH07176767A | 1995-07-14 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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