Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/055692
Kind Code:
A1
Abstract:
A semiconductor device according to this embodiment includes a laminate body and a columnar part. The laminate body includes: a first laminate part including a plurality of electrode layers laminated in a first direction with insulating bodies therebetween; a second laminate part including a plurality of electrode layers laminated in the first direction with insulating bodies therebetween, the second laminate part being disposed separated from the first laminate part in the first direction; and a linking part provided between the first laminate part and the second laminate part, the linking part including a high dielectric layer having higher relative permittivity than the insulating bodies. The columnar part includes: a first portion provided in the first laminate part, extending in the first direction of the laminate body; a second portion provided in the second laminate part, extending in the first direction; and an intermediate part provided in the linking part, connecting the first portion and the second portion.
Inventors:
SHIRAI KAITO (JP)
TAKEKIDA HIDETO (JP)
IZUMI TATSUO (JP)
SHAMOTO REIKO (JP)
KANEMURA TAKAHISA (JP)
KONDO SHIGEO (JP)
TAKEKIDA HIDETO (JP)
IZUMI TATSUO (JP)
SHAMOTO REIKO (JP)
KANEMURA TAKAHISA (JP)
KONDO SHIGEO (JP)
Application Number:
PCT/JP2016/077817
Publication Date:
March 29, 2018
Filing Date:
September 21, 2016
Export Citation:
Assignee:
TOSHIBA MEMORY CORP (JP)
International Classes:
H01L27/115
Foreign References:
| JP2011249803A | 2011-12-08 | |||
| JP2015056444A | 2015-03-23 | |||
| JP2010114204A | 2010-05-20 | |||
| JP2011066417A | 2011-03-31 | |||
| JP2009146954A | 2009-07-02 |
Attorney, Agent or Firm:
HYUGAJI, Masahiko (JP)
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