Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/106820
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a semiconductor device with which the influence of dimensional tolerances can be suppressed; and a method for manufacturing said semiconductor device. This semiconductor device is provided with: a plurality of cooling plates (1) each having refrigerant channels (11) therein; spacers (5) for stacking the cooling plates (1) away from each other; semiconductor packages (2) provided on at least one main surface of at least one cooling plate (1); and spring plates (4) provided between adjacent cooling plates (1) and urging the semiconductor packages (2) toward the cooling plates (1).
More Like This:
| WO/2015/141714 | COOLER, AND SEMICONDUCTOR MODULE USING SAME |
| WO/2012/147544 | COOLER FOR SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE |
| JP2023023517 | LIQUID COOLING JACKET AND COOLING DEVICE |
Inventors:
KOMO HIDEO (JP)
SHIRASAWA TAKAAKI (JP)
ARAKI SHINTARO (JP)
KIMOTO NOBUYOSHI (JP)
OMARU TAKESHI (JP)
SHIRASAWA TAKAAKI (JP)
ARAKI SHINTARO (JP)
KIMOTO NOBUYOSHI (JP)
OMARU TAKESHI (JP)
Application Number:
PCT/JP2017/043232
Publication Date:
June 06, 2019
Filing Date:
December 01, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H05K7/20
Foreign References:
| JP2005228919A | 2005-08-25 | |||
| JP2009076600A | 2009-04-09 | |||
| JP2009212137A | 2009-09-17 | |||
| JP2012004358A | 2012-01-05 | |||
| JP2014056853A | 2014-03-27 | |||
| JP2014033119A | 2014-02-20 | |||
| JP2013187334A | 2013-09-19 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Download PDF: