Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/188131
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a substrate; a first semiconductor element provided on the substrate; a stopper film covering the first semiconductor element; a second semiconductor element located opposite to the first semiconductor element with the stopper film therebetween; an insulating film provided between the second semiconductor element and the stopper film; and wiring which penetrates the insulating film and the stopper film and which electrically connects the second semiconductor element with the first semiconductor element.
Inventors:
NAKAMURA YUTA (JP)
NAGAHAMA YOSHIHIKO (JP)
SAITO SUGURU (JP)
NAGAHAMA YOSHIHIKO (JP)
SAITO SUGURU (JP)
Application Number:
PCT/JP2019/009398
Publication Date:
October 03, 2019
Filing Date:
March 08, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L25/065; H01L21/768; H01L23/12; H01L23/532; H01L25/07; H01L25/18; H01L27/146
Domestic Patent References:
| WO2012161044A1 | 2012-11-29 |
Foreign References:
| JP2015216334A | 2015-12-03 | |||
| JP2006270037A | 2006-10-05 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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