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Title:
SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/032323
Kind Code:
A1
Abstract:
A semiconductor device according to an embodiment comprises: a semiconductor chip 1 having a passivation film 11; and a mounting board 2 having a surface that faces a surface of the semiconductor chip 1 on which the passivation film 11 is provided. The semiconductor chip 1 includes pads 3 formed so as to protrude from an outer surface of the passivation film 11. The mounting board 2 has pads 4, and the pads 3 and the pads 4 come into contact with one another in a state in which an oxide film or adsorbed substance has been removed from a region of contact between the pads 3 and the pads 4.

Inventors:
IKEI HITOSHI (JP)
MATSUO TAKASHI (JP)
KITA TSUNEHIRO (JP)
Application Number:
PCT/JP2022/013702
Publication Date:
March 09, 2023
Filing Date:
March 23, 2022
Export Citation:
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Assignee:
KIOXIA CORP (JP)
International Classes:
H01L23/12; H01L21/3205; H01L21/60; H01L21/768; H01L23/522
Domestic Patent References:
WO2018220998A12018-12-06
Foreign References:
JP2020004793A2020-01-09
JP2005260173A2005-09-22
JP2013207183A2013-10-07
JP2000243904A2000-09-08
JP2012156231A2012-08-16
JP2004095885A2004-03-25
JP2011119717A2011-06-16
JP2015173196A2015-10-01
JP2020017668A2020-01-30
US20200043890A12020-02-06
Attorney, Agent or Firm:
ITOH-SHIN PATENT OFFICE (JP)
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