Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/024796
Kind Code:
A1
Abstract:
Provided is a semiconductor device mount structure obtained by connecting a first protrusion electrode [a bump (A5)] formed on a first electronic component [a substrate (2) or a semiconductor element (A1)] and a second protrusion electrode [a bump (B6)]formed on a second electronic component [a semiconductor element (B11)]. The first protrusion electrode and the second protrusion electrode are made of different metal materials. The first protrusion electrode is harder than the second protrusion electrode, has a head in an acute shape, and is fixed in the second protrusion electrode.
Inventors:
MORI KATSUNORI
FUKUI YASUKI
TATSUMI KAZUAKI
MIHARA TAKAYUKI
FUKUI YASUKI
TATSUMI KAZUAKI
MIHARA TAKAYUKI
Application Number:
PCT/JP2013/071005
Publication Date:
February 13, 2014
Filing Date:
August 02, 2013
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2000216198A | 2000-08-04 | |||
| JPH08213425A | 1996-08-20 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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