Title:
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/002006
Kind Code:
A1
Abstract:
A semiconductor device (10) is provided with a base plate (1), a substrate (2), a semiconductor element (3), a case (4), and a wiring terminal (5). The case (4) is positioned on the base plate (1) so as to cover the substrate (2) and the semiconductor element (3). The wiring terminal (5) is electrically connected to the semiconductor element (3). The case (4) comprises a first case part (41) and a second case part (42) separate from the first case part (41). The wiring terminal (5) comprises a first wiring section (51) and a second wiring section (50). The first wiring section (51) is positioned so as to protrude from inside to outside of the case (4), and is electrically connected to the semiconductor element. The second wiring section (52) is bent with respect to the first wiring section (51) and is arranged outside of the case (4). The first case part (41) and the second case part (42) are arranged so as to hold the first wiring section (51) therebetween.
Inventors:
SATO YUJI (JP)
YOKOYAMA YOSHINORI (JP)
YOSHIDA MOTORU (JP)
FUJITA JUN (JP)
YOKOYAMA YOSHINORI (JP)
YOSHIDA MOTORU (JP)
FUJITA JUN (JP)
Application Number:
PCT/JP2019/026683
Publication Date:
January 07, 2021
Filing Date:
July 04, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/04
Domestic Patent References:
| WO2016158072A1 | 2016-10-06 |
Foreign References:
| JP2009021286A | 2009-01-29 | |||
| JP2008130984A | 2008-06-05 | |||
| JP2017147914A | 2017-08-24 | |||
| JP2010251614A | 2010-11-04 | |||
| JP2018081980A | 2018-05-24 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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