Title:
SEMICONDUCTOR DEVICE AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2017/188368
Kind Code:
A1
Abstract:
A semiconductor device (100) is provided with: semiconductor elements (29u-29w); an insulating mold section (20b) that encloses the semiconductor elements (29u-29w); terminals (23a, 23b, 23u, 23v, 23w), which are connected to the semiconductor elements (29u-29w), and which protrude from the insulating mold section (20b); and a cooler (90), on which the insulating mold section (20b) is placed, said cooler cooling the semiconductor elements (29u-29w). In a cooler (90) surface on which the insulating mold section (20b) is placed, a recessed section (91) is formed from a position facing the terminals (23a, 23b, 23u, 23v, 23w) toward further inside than an end portion of the insulating mold section (20b).
Inventors:
SATOU YUTAKA (JP)
OOI YASUYUKI (JP)
OOI YASUYUKI (JP)
Application Number:
PCT/JP2017/016696
Publication Date:
November 02, 2017
Filing Date:
April 27, 2017
Export Citation:
Assignee:
CALSONIC KANSEI CORP (JP)
International Classes:
H01L25/07; B60L9/18; H01L23/473; H01L25/18; H02M7/48
Domestic Patent References:
| WO2015043795A2 | 2015-04-02 | |||
| WO2012090307A1 | 2012-07-05 |
Foreign References:
| US20100059870A1 | 2010-03-11 | |||
| JP2011258632A | 2011-12-22 | |||
| JP2008186890A | 2008-08-14 | |||
| JPH09153574A | 1997-06-10 | |||
| US20070205503A1 | 2007-09-06 | |||
| JP2013110181A | 2013-06-06 | |||
| US20110227205A1 | 2011-09-22 | |||
| JPH09129796A | 1997-05-16 | |||
| JP2012178504A | 2012-09-13 |
Attorney, Agent or Firm:
GOTOH & PARTNERS (JP)
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