Title:
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/244392
Kind Code:
A1
Abstract:
The present invention makes it possible to reliably mechanically and electrically connect conductive posts. A semiconductor device (10) in which a printed board (30) is arranged opposite an insulating circuit board (20) such that the printed board (30) and a top surface of the insulating circuit board (20) sandwich spacer parts (50), and pressing parts (51) are arranged above the spacer parts (50) on a top surface of the printed board (30) such that the pressing parts (51) and the spacer parts (50) sandwich the printed board (30). The pressing parts (51) make it possible to correct warpage of the printed board (30) caused by the application of heat to bond conductive posts (41a–41e) to the insulating circuit board (20) and semiconductor chips (24a, 24b). Because the printed board (30) is kept substantially horizontal, lower end parts of the conductive posts (41a–41e) are bonded to the insulating circuit board (20) and the semiconductor chips (24a, 24b) without withdrawing from the insulating circuit board (20) and the semiconductor chips (24a, 24b).
Inventors:
NONAKA TOMOMI (JP)
Application Number:
PCT/JP2022/009685
Publication Date:
November 24, 2022
Filing Date:
March 07, 2022
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L25/07; H01L21/60; H01L25/18
Domestic Patent References:
| WO2015151235A1 | 2015-10-08 | |||
| WO2015064231A1 | 2015-05-07 | |||
| WO2009069308A1 | 2009-06-04 |
Foreign References:
| JP2014057004A | 2014-03-27 | |||
| JP2010165764A | 2010-07-29 | |||
| JP2015198216A | 2015-11-09 | |||
| JP2006066427A | 2006-03-09 | |||
| JP2014154806A | 2014-08-25 | |||
| JP2020136293A | 2020-08-31 | |||
| JP2010165764A | 2010-07-29 | |||
| JP2019140315A | 2019-08-22 | |||
| JP2013191806A | 2013-09-26 |
Attorney, Agent or Firm:
FUSO INTERNATIONAL PATENT FIRM (JP)
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