Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/118478
Kind Code:
A1
Abstract:
Recessed grooves (7) are provided on the side surfaces (5, 6) of respective conductive pattern (3) and a rear surface heat dissipating plate (4) of an insulating substrate (1) having the conductive pattern formed thereon, and the recessed grooves (7) are filled with a mold resin (15). A bonding area for the mold resin (15) is increased by providing the recessed grooves (7). Furthermore, anchor effects are generated due to having the recessed grooves (7) filled with the mold resin (15), and adhesiveness between the insulating substrate (1) and the mold resin (15) can be improved. As a result, reliability of a semiconductor device (100) can be improved. Furthermore, since the recessed grooves (7) are formed on the side surfaces (5, 6) of respective conductive pattern (3) and rear surface heat dissipating plate (4), an outer shape of the semiconductor device (100) is not increased.
Inventors:
NASHIDA NORIHIRO (JP)
NAKAMURA HIDEYO (JP)
NAKAMURA HIDEYO (JP)
Application Number:
PCT/JP2013/000570
Publication Date:
August 15, 2013
Filing Date:
February 01, 2013
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L23/28; H01L23/12; H01L23/34; H01L25/07; H01L25/18
Foreign References:
| JP2011142124A | 2011-07-21 | |||
| JP2011258814A | 2011-12-22 | |||
| JPH0613501A | 1994-01-21 |
Attorney, Agent or Firm:
MATSUMOTO, YOICHI (JP)
Yoichi Matsumoto (JP)
Yoichi Matsumoto (JP)
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