Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/080449
Kind Code:
A1
Abstract:
The present description relates to a semiconductor device in which a semiconductor element is molded from resin and the semiconductor element is bonded to a lead frame that is exposed on the surface of a mold. The present description provides a feature that makes it possible, even if the bonding member cracks due to progressive fatigue deterioration, to reduce the impact of the cracks on the semiconductor element. A semiconductor device (2) is provided with the following: a transistor (3); lead frames (8a, 8b); a metal spacer (4) that is bonded on one surface thereof to the transistor (3) by means of a first bonding member (5) and is also bonded on the other surface thereof to the lead frame (8a) by means of a second bonding member (6); and a resin molding body (13). The resin molding body (13) seals the transistor (3) and the metal spacer (4). One surface of the lead frames (8a, 8b) adheres to the resin molding body (13). A material with a lower strength than that of the first bonding member (5) is selected for the second bonding member (6).
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Inventors:
ASAI RINTARO (JP)
TANIDA ATSUSHI (JP)
TANIDA ATSUSHI (JP)
Application Number:
PCT/JP2012/080031
Publication Date:
May 30, 2014
Filing Date:
November 20, 2012
Export Citation:
Assignee:
TOYOTA MOTOR CO LTD (JP)
ASAI RINTARO (JP)
TANIDA ATSUSHI (JP)
ASAI RINTARO (JP)
TANIDA ATSUSHI (JP)
International Classes:
H01L23/48; H01L21/52; H01L21/60
Foreign References:
| JP2010103350A | 2010-05-06 | |||
| JP2004128176A | 2004-04-22 | |||
| JP2003110064A | 2003-04-11 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
Patent business corporation KAI-U Patent Law Firm (JP)
Patent business corporation KAI-U Patent Law Firm (JP)
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