Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/167871
Kind Code:
A1
Abstract:
In order to improve a shielding effect against electromagnetic waves, a semiconductor device (10) has: a wiring board (12) on which is formed an element section (12E) and a fixed potential electrode (18A, 18B); a first semiconductor element (22) provided on the wiring board (12) and having a semiconductor circuit (34) in electrconductive communication with the element section (12E); and a second semiconductor element (24) having a metal body not in electroconductive communication with the first semiconductor element (22) but in electroconductive communication with the fixed potential electrode (18A, 18B), and having a semiconductor body in contact with the metal body, the second semiconductor element (24) being joined to the first semiconductor element (22) via an insulating adhesive (52).
Inventors:
KUROTANI KINGO (JP)
Application Number:
PCT/JP2014/051409
Publication Date:
October 16, 2014
Filing Date:
January 23, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2009111010A | 2009-05-21 | |||
| JP2004235244A | 2004-08-19 | |||
| JPH09252191A | 1997-09-22 | |||
| JP2006237450A | 2006-09-07 | |||
| JP2011181730A | 2011-09-15 | |||
| JP2012064983A | 2012-03-29 | |||
| JPH08255993A | 1996-10-01 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
Yoshiyuki Inaba (JP)
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