Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/192118
Kind Code:
A1
Abstract:
This semiconductor device is provided with a first semiconductor chip, a second semiconductor chip, and a main electrode which is electrically connected to the first semiconductor chip and the second semiconductor chip. The main electrode is provided with a first electrode section having one end that is electrically connected to the first semiconductor chip, a second electrode section having one end that is electrically connected to the second semiconductor chip, a connection section that connects the other end of the first electrode section and the other end of the second electrode section, a body section connected to the connection section, and an external connection section connected to a portion of the body section on the first electrode section side. The inductance of a current path from the one end of the first electrode section to the external connection section is larger than the inductance of a current path from the one end of the second electrode section to the external connection section when the effect of a magnetic field from the body section is eliminated.
Inventors:
SAKAI YASUHIRO (JP)
KITAMURA SHUICHI (JP)
KITAMURA SHUICHI (JP)
Application Number:
PCT/JP2013/065064
Publication Date:
December 04, 2014
Filing Date:
May 30, 2013
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L25/18; H02M7/48
Foreign References:
| JPH07249735A | 1995-09-26 | |||
| JP2009105454A | 2009-05-14 | |||
| JP2001144250A | 2001-05-25 | |||
| JP2002353407A | 2002-12-06 | |||
| JP2013141371A | 2013-07-18 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
Takada 守 (JP)
Takada 守 (JP)
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