Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/107871
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a substrate (1) formed of a metal; first metal wiring (3) disposed above the substrate (1); a first semiconductor element (5a) and a second semiconductor element (5b), which are disposed above the first metal wiring (3); and second metal wiring (6) disposed above the first semiconductor element (5a) and the second semiconductor element (5b). The semiconductor device is also provided with a plurality of protrusions (71a, 72a, 71b, 72b), which are provided between the first metal wiring (3) and each of the first semiconductor element (5a) and the second semiconductor element (5b), and/or between the second metal wiring (6) and each of the first semiconductor element (5a) and the second semiconductor element (5b).
Inventors:
KIMURA JUN ICHI
NAKAGUCHI MASAHISA
ITO FUMITO
HOZUMI NORIMITSU
NAKAGUCHI MASAHISA
ITO FUMITO
HOZUMI NORIMITSU
Application Number:
PCT/JP2015/000027
Publication Date:
July 23, 2015
Filing Date:
January 07, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L25/07; H01L25/18
Foreign References:
| JP2002217364A | 2002-08-02 | |||
| JP2004134445A | 2004-04-30 | |||
| JP2010034278A | 2010-02-12 | |||
| JP2002190569A | 2002-07-05 | |||
| JP2009302101A | 2009-12-24 | |||
| JP2004014919A | 2004-01-15 | |||
| JP2013070011A | 2013-04-18 | |||
| JP2012074543A | 2012-04-12 | |||
| JP2010092918A | 2010-04-22 |
Attorney, Agent or Firm:
FUJII, Kentaro et al. (JP)
Fujii Kentaro (JP)
Fujii Kentaro (JP)
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