Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/006065
Kind Code:
A1
Abstract:
A metal base plate (1) has a through-hole (2) therein. An insulating substrate (3) is provided on the base plate (1). A semiconductor chip (4) is provided on the insulating substrate (3). A case (8) has a screw-hole (9) connected to the through-hole (2), covers the insulating substrate (3) and the semiconductor chip (4), and is provided on the base plate (1). A metal screw (11) is inserted into the through-hole (2) and the screw-hole (9), and affixes the case (8) to the base plate (1). A soft, flexible material (12) fills the cavity formed between the tip of the screw (11) and the bottom surface of the screw-hole (9) in the case (8).
Inventors:
HIRONAKA YOICHI (JP)
KOGA MASUO (JP)
KOGA MASUO (JP)
Application Number:
PCT/JP2014/068331
Publication Date:
January 14, 2016
Filing Date:
July 09, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L25/18
Foreign References:
| JP2013074284A | 2013-04-22 | |||
| JPH10290000A | 1998-10-27 | |||
| JPH10233482A | 1998-09-02 | |||
| US20040056349A1 | 2004-03-25 | |||
| EP1283589A2 | 2003-02-12 | |||
| JP2006032392A | 2006-02-02 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
Takada 守 (JP)
Takada 守 (JP)
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