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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/013769
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a first semiconductor chip and a second semiconductor chip, which are disposed by being electrically insulated from each other; and a first signal path and a second signal path, which transmit signals from the first semiconductor chip to the second semiconductor chip by means of magnetic field coupling in a chip transformer wherein a conductor layer and an insulating layer are laminated. Operations of the second semiconductor chip are controlled by means of first control signals transmitted via the first signal path, and second control signals transmitted via the second signal path.

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Inventors:
PARK HYO-JEONG (JP)
TAJIMA KAZUNAO (JP)
Application Number:
PCT/JP2015/070836
Publication Date:
January 26, 2017
Filing Date:
July 22, 2015
Export Citation:
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Assignee:
SANKEN ELECTRIC CO LTD (JP)
International Classes:
H04L25/02; H01F17/00; H01L25/00; H04B5/02
Domestic Patent References:
WO2013027454A12013-02-28
Foreign References:
JP2015015697A2015-01-22
JP2013229812A2013-11-07
JPH04133408A1992-05-07
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
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