Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/131473
Kind Code:
A1
Abstract:
This semiconductor device 1 is provided with: a ceramic substrate 21 which has conductor layers 23, 24 on both surfaces; a semiconductor element 11 which is bonded onto the upper conductor layer 23 of the ceramic substrate 21; a frame member 61 which is arranged on the upper conductor layer 23 so as to surround the lateral surface of the semiconductor element 11; and an electrode 41 which is bonded on top of the semiconductor element 11 by means of a second bonding layer 32, while being provided with a fitting part 42 in the lateral surface. The inner wall of the frame member 61 is provided with: a fitting part 62 that fits with the fitting part 42 of the electrode 41; and four positioning parts 63 that extend from the inner wall of the frame member 61 to the lateral surface of the electrode 41.
Inventors:
MURAMATSU YUYA (JP)
BESSHI NORIYUKI (JP)
ISHII RYUICHI (JP)
BESSHI NORIYUKI (JP)
ISHII RYUICHI (JP)
Application Number:
PCT/JP2017/046731
Publication Date:
July 19, 2018
Filing Date:
December 26, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/18
Foreign References:
| JP2016051878A | 2016-04-11 | |||
| JP2015041716A | 2015-03-02 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
Download PDF: